Fully automatic dicing machine for Φ200mm wafers
*Spindle equipped specification T(Twin): opposing type 2-axis spindle specification, S(Single): 1-axis spindle specification The device inherits the design platform of the Φ 300mm compatible machine, the AD3000T-PLUS. The opposing type 2-axis spindles are arranged diagonally, to achieve both a reduced space design and high maintainability. The use of our originally developed axial mechanism contributes to the speeding up of the X, Y, Z axes and the enhanced throughput. A 1.8 kW rating, high-output spindle is equipped as standard. A broad range of dicing uses from electronic devices to power semiconductors, etc. can be supported.
CMP system for 300 mm wafer that fully meets the process performance required in advanced devices as well as responds to the demand from mass-production plants
Fusing the acquired technology of precision measuring instrument and semiconductor manufacturing equipment, Accretech fully meets the process performance required in advanced devices, and proposes CMP systems (ChaMP series) for 300 mm wafer responded to the demand from volume-production plant.
Power device testing system for 200mm wafer.
The best system for power device measurement with ACCRETECH's contact technology and wide applications combined with TESEC's measuring technology.
Probing machine for 300 mm framed wafers.
High precision model for the 300 mm wafers Supporting CSP/WLP/PLP devices that is affixed on dicing frames.
Multiple chambers probing machine for NAND flash memory.
Accretech Probing Machine for full wafer testing on a single touch down. Developed with capability to simultaneously measure on 12 stages with dedicate XY stage and POGO tower.
Probing machine for 200 mm framed wafers.
High precision model for the 200 mm wafers Supporting CSP/WLCSP devices that is affixed on dicing frames.
High Rigid 1-Axis Grinder.
Fully Automatic High Rigid 1-Axis Grinder In addition to the fully automatic transfer of up to Φ200 mm, it supports a wide range of applications such as frame-mounted wafers and boule transfer of up to 50 mm thickness.
Fully Automatic High Rigid 3-Axis Grinder.
It realizes ultra-thinning processing at high speed and high precision, and thus contributes to a wide range of thinning processes in the entire semiconductor process.
Sliced Wafer Demounting and Cleaning Machine.
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.